System for reducing friction-induced wear of pipe

ABSTRACT

A buffer for holding a pipe adapted to transport a fluid is provided. The buffer includes a base, a plurality of fingers extending outwardly from a first side of the base. A first finger of the plurality of fingers and a second finger of the plurality of fingers define a cavity for receiving the pipe. The buffer further includes at least one roller on a second side of the base opposite the first side.

PRIORITY CLAIM

This application claims priority to U.S. Provisional Patent ApplicationSer. No. 62/753,376 filed Oct. 31, 2018, which is incorporated herein byreference in its entirety.

BACKGROUND

In the manufacture of integrated circuits, hundreds of processing steps,including deposition, photolithography, chemical mechanicalplanarization (CMP), ion implantation, diffusion, etching and cleaning,are used to fabricate circuit components on a semiconductor wafer.Numerous semiconductor processing tools are utilized during thefabrication of integrated circuits.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a perspective view of a buffer that is usable to reducefriction-induced wear of a pipe for transporting a fluid, in accordancewith some embodiments.

FIG. 2 is a perspective view of a buffer holding a fluid-transportingpipe and an electrical cable over a support plate, in accordance withsome embodiments.

FIG. 3 is a schematic diagram of a system for monitoring the wear of oneor more rollers in the buffer over time, in accordance with someembodiments.

FIG. 3A is a plot illustrating changes in acoustic wave intensity as abuffer wears, in accordance with some embodiments.

FIG. 4 is a schematic diagram of an arrangement in a semiconductorfabrication facility using a buffer, in accordance with someembodiments.

FIG. 5 is a flow chart of a method for monitoring the wear of one ormore rollers in a buffer, in accordance with some embodiments.

FIG. 6 is a schematic diagram of a controller system, in accordance withsome embodiments

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components, values, operations, materials,arrangements, or the like, are described below to simplify the presentdisclosure. These are, of course, merely examples and are not intendedto be limiting. Other components, values, operations, materials,arrangements, or the like, are contemplated. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. System may be otherwise oriented (rotated 90 degrees or atother orientations) and the spatially relative descriptors used hereinmay likewise be interpreted accordingly.

Pipes such as plastic pipes made of Teflon™ fluoropolymers are widelyused to distribute fluids throughout a semiconductor fabricationfacility. Fluoropolymers are chemically inert, thus reducing the risk ofcontamination and on-wafer defects associated with metal pipes. In someinstances, in various fabrication steps for formation of integratedcircuits, process fluids, including process gasses and process liquids,are utilized. Process fluids are stored in tanks and are transportedfrom tanks to semiconductor processing tools in which the process fluidsare used by way of pipes. In some instances, in fabrication ofintegrated circuits, various fabrication processes are conducted insemiconductor processing tools. These semiconductor processing toolsinclude processing chambers used in chemical vapor deposition (CVD),physical vapor deposition (PVD), or growing native oxides such assilicon oxide. Components inside the processing chambers are heated upduring the deposition operation. To maintain temperature in theprocessing chambers, a cooling system is provided to control thetemperatures of processing chambers. The cooling system circulates acooling liquid such as water or a mixture of water and glycol throughpipes to remove heat from the processing chambers.

Initially, a pipe is maintained in a state of being aligned in astraight line. However, with the increasing time duration in use of thepipe, the pipe ages. Sagging or drooping of the pipe occurs due togravity or other forces, and excessive sagging or drooping of the pipecauses the pipe to touch a support plate (e.g., a metal plate) where thesemiconductor processing tools are placed. As a fluid is transportedthrough the pipe, the pipe vibrates and rubs against the surface of thesupport plate which has a high coefficient of friction. Over time, thefriction between the pipe and the surface of the support plate causesthe pipe to break, resulting in a leakage of the fluid that flowsthrough the pipe. The fluid leakage exposes workers to the leaked fluidor causes shorts of electronic components in the semiconductorfabrication facility, thus compromising the fabrication of integratedcircuits.

A buffer is provided to help to prevent the friction-induced damages tothe fluid-transporting pipes used in a semiconductor fabricationfacility. The buffer is configured to support and elevate afluid-transporting pipe, thereby helping to prevent thefluid-transporting pipe from rubbing against a support plate wheresemiconductor processing tools are placed. The buffer includes amaterial having a coefficient of friction lower than the coefficient offriction of the surface material of the support plate so as to provide alow friction contact between the pipe and the buffer. Separating thefluid-transporting pipe from the support plate using a low frictionbuffer thus helps to improve the durability of the fluid-transportingpipe. One or more rollers are provided at the bottom of the buffer whichallow the buffer to move in any direction on the support plate. The oneor more rollers reduce the contact area between the buffer and thesupport plate, thereby helping to reduce the friction between the bufferand the support plate. As a result, the lifetime of the buffer isincreased. The wear of the one or more rollers is monitored by anacoustic sensor configured to detect sound waves generated as the one ormore rollers move on the support plate. When an abnormal sound wavecaused by the wear of the one or more rollers is detected by theacoustic sensor, an operator is notified to determine when to replacethe worn rollers before any damage to the pipe occurs.

FIG. 1 is a perspective view of a buffer 100 that is usable to hold apipe so as to reduce friction-induced cracking of the pipe, inaccordance with some embodiments. In some embodiments, the pipe isadapted to transport a fluid in a fluid supply system in a semiconductorfabrication facility.

Referring to FIG. 1, the buffer 100 includes a base 110, a plurality offingers (e.g., fingers 122, 124 and 126) extending outwardly from oneside of the base 110 and spaced from each other, and one or more rollers152 on an opposite side of the base 110 from the plurality of fingers122, 124 and 126. The number of the rollers 152 is determined by thesize of the base 110. In some embodiments, the plurality of fingers 122,124 and 126 and one or more rollers 152 have a unitary construction withthe base 110, i.e., the base 110, the plurality of fingers 122, 124 and126, and the one or more rollers 152 being integral with each other.

In some embodiments, the plurality of fingers includes a first finger122 extending outwardly from a first end 110 a of the base 110, a secondfinger 124 extending outwardly from a central portion 110 b of the base110, and a third finger 126 extending outwardly from a second end 110 cof the base 110 opposite the first end 110 a. The first finger 122 isconfigured to have a length less than a length of each of the secondfinger 124 and the third finger 126. In some embodiments, the secondfinger 124 and the third finger 126 have a same length. In someembodiments, the second finger 124 and the third finger 126 havedifferent lengths. The first finger 122 includes a ridge 132 protrudingfrom a free end 122 a of the first finger 122 and toward the secondfinger 124. The second finger 124 includes a ridge 134 protruding fromthe second finger 124 and toward the first finger 122. The ridges 132and 134 face each other and define an open end 136 a of a cavity 136formed by the first finger 122, a first segment of the base 110 (hereinreferred to as a first base segment 112), and a portion of the secondfinger 124. The cavity 136 is configured to receive a pipe 142 (FIG. 2)for transporting a fluid (also referred to as fluid-transporting pipe)when the buffer 100 is in use. In some embodiments, the cavity 136 isC-shaped having a curved inner surface. The dimension of the cavity 136is determined based on the size of the fluid-transporting pipe 142 to beheld therein. In some embodiments, the cavity 136 is dimensioned to fita one-inch pipe. In some embodiments, the cavity 136 is dimensioned tofit a three-quarter-inch pipe. In some embodiments, the cavity 136 hasgreater or lesser dimensions for different diameter pipes. The open end136 a of the cavity 136 from which the fluid-transporting pipe 142 isinserted is configured to have a dimension less than a diameter of thefluid-transporting pipe 142 such that once the fluid-transporting pipe142 is forced into the cavity 136, the cavity 136 holds thefluid-transporting pipe 142 firmly in place. The dimension of the openend 136 a of the cavity 136 is determined by the heights of the ridges132 and 134. The second finger 124, the third finger 126, and a secondsegment of the base 110 (herein referred to as second base segment 114)define a cavity 138. In some embodiments, the second base segment 114has a curved surface. The dimension of the cavity 138 is configured toaccommodate an electrical cable 144 (FIG. 2) when the buffer 100 is inuse. In some embodiments, the cavity 138 has a uniform dimension that isless than a diameter of the electrical cable 144 such that once theelectrical cable 144 is forced into the cavity 138, the electric cable144 is pressed by the second finger 124 and the third finger 126, whichprevents the electrical cable 144 from sliding out of the cavity 138. Insome embodiments, the cavity 138 is slanted such that the dimension ofthe cavity 138 reduces gradually towards the free ends of the secondfinger 124 and the third finger 126. In some embodiments, an open end138 a of the cavity 138 is configured to have a dimension less than thediameter of the electrical cable 144. The smaller dimension of the openend 138 a of the cavity 138 helps to prevent the electrical cable 144from sliding out of the cavity 138 once the electrical cable 144 isreceived into inner portion of the cavity 138 The third finger 126 isoptional, and in some embodiments, the third finger 126 is omitted. Inthe embodiments where the third finger 126 is omitted, the second finger124 is present at the second end 110 c of the base 110.

The one or more rollers 152 are protrusions protruding from the base 110of the buffer 100 and are adapted to allow the buffer 100 to move in anydirection. The one or more rollers 152 are configured to reduce thefriction between the buffer 100 and a support plate 102 (FIG. 2) overwhich the buffer 100 is placed. In some embodiments, each roller 152 ofthe one or more rollers 152 is a hemispherical-shaped protrusion havinga rounded bottom side adapted to contact the support plate 102 when thebuffer 100 is in use. The rounded bottom side reduces the contact areabetween the buffer 100 and the support plate 102, thereby helping toreduce the friction between the buffer 100 and the support plate 102 andto increase the durability of the buffer 100. The buffer 100 alsoincludes a ring 154 surrounding each roller 152. The ring 154 isoptional, and in some embodiments, the ring 154 is omitted.

In some embodiment, the buffer 100 includes a material having a lowercoefficient of friction than the material of the underlying supportplate. As used herein, coefficient of friction refers to a kineticcoefficient of friction which is defined as the ratio of the normalforce required to maintain a steady state motion of an object sliding ona given surface. In some embodiments, the support plate includes metalsuch as iron. In some embodiments, the support plate includes wood orplywood. In some embodiments, the coefficient of friction of the lowfriction material of the buffer 100 is less than 0.1. In someembodiments, the buffer 100 includes polytetrafluoroethylene (PTFE),perfluoroalkoxy (PFA), fluorinated poly ethylene propylene (FPEP),polyvinylidene fluoride (PVDF), polysulfone, or polyether ether ketone(PEEK).

FIG. 2 is a perspective view of a buffer 100 holding afluid-transporting pipe 142 and an electrical cable 144 over a supportplate 102, in accordance with some embodiments. In FIG. 2, the buffer100 is configured to hold the fluid-transporting pipe 142 and theelectrical cable 144 in the cavities 136 and 138, respectively. Thebuffer 100 thus acts as a cushion to avoid the direct contact of thefluid-transporting pipe 142 and the electrical cable 144 with thesupport plate 102, which helps to eliminate the effect of the highfriction force applied on the fluid-transporting pipe 142 and theelectrical cable 144 by the support plate 102. The low friction materialused in the buffer 100 provides low friction contact surfaces when thefluid-transporting pipe 142 and the electrical cable 144 are received inthe cavity 136 and the cavity 138 of the buffer 100, respectively. As aresult, the friction-induced wear of the fluid-transporting pipe 142 orthe electrical cable 144 is reduced, and the usable time of thefluid-transporting pipe 142 or the electrical cable 144 is increased.

FIG. 3 is a schematic diagram of a system 300 for monitoring the wear ofone or more rollers 152 in the buffer 100 over time, in according withsome embodiments.

Referring to FIG. 3, the system 300 includes an acoustic sensor 310 anda sensor control unit 320. The acoustic sensor 310 is adapted to detectacoustic waves generated during the use of the buffer 100 due to thevibration of the one or more rollers 152 caused by the friction forcebetween the one or more rollers 152 and the support plate 102. As aroller 152 wears, the height of the roller 152 reduces due to thefriction between the roller 152 and the support plate 102 (FIG. 2).Consequently, the contact area between the roller 152 and the supportplate 102 increases with time. The frequencies of the acoustic wavesmeasured by the acoustic sensor 310 thus change over time with theincreased contact area between the roller 152 and the support plate 102.The changes in frequencies of the acoustic waves are usable to evaluatethe amount of the wear of the roller 152.

FIG. 3A is a plot illustrating changes in acoustic wave intensity as abuffer 100 wears, in accordance with some embodiments. Curve 340illustrates an initial acoustic wave intensity of a buffer 100 as afunction of time. Curve 350 illustrates an acoustic wave intensity ofthe buffer 100 as a function of time after the roller 152 starts wearingwhen the buffer 100 has been used for a certain period of time. Comparedto the intensity of the initial acoustic wave 340, after the buffer 100has been used for a certain period of time, the intensity of theacoustic wave 350 increases about 10 hertz (Hz).

The acoustic sensor 310 is placed close to the buffer 100 such thatacoustic waves originated from the abrasive force between the one ormore rollers 152 and the support plate 102 are able to be received bythe acoustic sensor 310. In some embodiments, the acoustic sensor 310 isplaced about 30 centimeter (cm) away from the buffer 100. If thedistance between the acoustic sensor 310 and the buffer 100 is toogreat, the risk that the acoustic sensor 310 is not able to detect theacoustic waves increases. In some embodiments, the acoustic sensor 310is an ultrasonic sensor usable to defect sound waves that are beyond anaudible range of frequency to human ears, typically above 20 kilohertz(kHz). The ultrasonic sensor operates at high frequencies, and thus hashigh sensitivity in detecting the acoustic waves generated by thecontact between the one or more rollers 152 and the support plate.

The sensor control unit 320 is adapted to analyze changes of frequenciesof the acoustic waves detected by the acoustic sensor 310. Once anintensity of acoustic wave signals exceeds a threshold value that isassociated with a normal operating condition of the one or more rollers152, an operator is notified to replace the buffer 100 to avoid theexcess abrasion between the buffer 100 and the support plate 102. Insome embodiments, the threshold value is set to be 3300 Hz. In someembodiments, the sensor control unit 320 is a multichannel control unit.The sensor control unit 320 communicates wirelessly, for instance, via acommunication network 330. In some embodiments, the sensor control unit320 communicates via a wired connection with acoustic sensor 310. Insome embodiments, the sensor control unit 320 is implemented by acontroller system 600 (FIG. 6), and the communication network 330 isimplemented by a network interface 608 in the controller system 600(FIG. 6).

FIG. 4 is a schematic diagram of an arrangement 400 in a semiconductorfabrication facility using a buffer 100 of FIG. 1 to reduce thefrication-induced wear of a pipe for transporting a fluid, in accordancewith some embodiments.

Referring to FIG. 4, the arrangement 400 includes a semiconductorprocessing system 410, a fluid supply system 420, a power supply 430,and a controller system 600.

The semiconductor processing system 410 includes at least one processingchamber 412. The at least one processing chamber 412 is designed toperform one or more semiconductor manufacturing processes applied to oneor more semiconductor wafers. In some embodiments, the processingchamber 412 is designed to perform the semiconductor manufacturingprocess, such as, deposition, thermal oxidation, implantation,lithography exposure, ion implantation, or etching. In some embodiments,the processing chamber 412 is a deposition tool, such as a chemicalvapor deposition (CVD) tool or a physical vapor deposition (PVD) tool.In some embodiments, the processing chamber 412 is a CVD tool usable toform a dielectric layer on a semiconductor substrate for isolation. Insome embodiments, the processing chamber 412 is a PVD tool usable toform a metal layer for interconnection. In some embodiments, theprocessing chamber 412 is an ion implantation tool usable to perform anion implantation process for forming one or more doped features, such assource/drain regions or N-type or P-type wells, in a semiconductorwafer. In some embodiments, the processing chamber 412 is a chemicalmechanical polishing (CMP) tool usable to polish a semiconductor waferto reduce the thickness variation and provide a planarized surface. Insome embodiments, the processing chamber 412 is a lithography toolusable to expose a photoresist layer on a semiconductor wafer using aradiation energy in order to form the patterned photoresist layer inassistance of other processing steps, such as etching, deposition, orion implantation. In some embodiments, the semiconductor processingsystem 410 is a cluster system having multiple processing chambersconfigured to perform a same processing function or different processingfunctions (not shown). The processing chamber 412 shown in FIG. 4 is oneprocessing chamber of the plurality of processing chambers in thecluster tool. In some embodiments, some processing chambers in theplurality of processing chambers are adopted for deposition of differentmaterials, such as, for example, titanium nitride (TiN), titanium (Ti),and aluminum (Al), and some of processing chambers in the plurality ofprocessing chambers are adopted for degassing, pre-cleaning, andcooling.

The fluid supply system 420 is adapted to supply a fluid for use insemiconductor processing operations. In some embodiments, the fluidsupply system 420 supplies a slurry to the processing chamber 412 forCMP operation. In some embodiments, the fluid supply system 420 suppliesa process gas or a process liquid to the processing chamber 412 fordeposition operation. In some embodiments, the fluid supply system 420supplies water to the processing chamber 412 for cooling components ofthe processing chamber 412.

The fluid is supplied to the processing chamber 412 via afluid-transporting pipe 422. The fluid-transporting pipe 422 issupported by a buffer 100. In some embodiments, the fluid-transportingpipe 422 is made of a chemically inert material such as, for example,polytetrafluoroethylene (PTFE). In some embodiments, thefluid-transporting pipe 422 is provided as a linear pipe fortransporting a process fluid to the processing chamber 412. In someembodiments, the fluid-transporting pipe 422 is provided as a coil-typepipe for distributing a cooling liquid to the processing chamber 412 orto a heat source (not shown).

The power supply 430 is usable to provide power to components of thesemiconductor processing system 410, the fluid supply system 420 and theacoustic sensor 310. The power supply 430 is electrically connected tothe semiconductor processing system 410, the fluid supply system 420,and the acoustic sensor 310 by respective electrical cables 432, 434 and436. In some embodiments, the electrical cable 432 that electricallyconnects the semiconductor processing system 410 to the power supply 430is received in the cavity 138 of the buffer 100 (FIG. 1).

The controller system 600 (described in detail in FIG. 6) is adapted tocontrol the operations of semiconductor processing system 410, the fluidsupply system 420 and the acoustic sensor 310.

The buffer 100 separates the fluid-transporting pipe 422 and theelectrical cable 432 from a support plate over which thefluid-transporting pipe 422 and the electrical cable 432 are placed. Thebuffer 100 is made of a material having a lower coefficient of frictionthan the coefficient of friction of the support plate, thereby helpingto reduce the friction-induced wear of the fluid-transporting pipe 422and the electrical cable 432. Using a buffer 100 increases the usablelifetime of the fluid-transporting pipe 422 and the electrical cable432. As a result, downtime of the semiconductor processing system 410caused by the changing of the worn pipe is reduced. The buffer 100 alsoseparates the electrical cable 432 from the support plate, and thushelps to reduce the risk of shorts caused by the leaked liquid when thefluid-transporting pipe 422 breaks.

FIG. 5 is a flow chart of a method 500 for monitoring wear of one ormore rollers 152 in a buffer 100, in accordance with some embodiments.In some embodiments, additional processes are performed before, during,and/or after the method 500 in FIG. 5, and some of processes describedherein are replaced or eliminated in some embodiments.

In operation 502, a buffer 100 is provided to separate afluid-transporting pipe 142 and/or an electrical cable 144 from asupport plate 102. The support plate 102 is made of a material having acoefficient of friction higher than the coefficient of friction of thematerial that provides the buffer 100. In some embodiments, thefluid-transporting pipe 142 and the electrical cable 144 are connectedto a semiconductor processing system 410 in a semiconductor fabricationfacility.

In operation 504, acoustic waves generated by the vibration of one ormore rollers 152 provided at the bottom of the buffer 100 arecontinuously monitored using an acoustic sensor 310.

In operation 506, changes in frequencies of the acoustic waves over timeare analyzed using a sensor control unit 320 to determine the wearingstatus of the one or more rollers 152.

In operation 508, after an increase of acoustic wave intensity due tothe wear of the one or more rollers 152 exceeds a threshold value thatis associated with a normal working condition of the one or more rollers152, the sensor control unit 320 triggers an alert to notify an operatorthat the buffer 100 is worn and needs to be replaced. In someembodiments, when the increase of intensity of the acoustic wave isabove 3300 Hz, the alert is triggered.

FIG. 6 is a schematic diagram of a controller system 600, in accordancewith some embodiments. The controller system 600 generates outputcontrol signals for controlling operations of the processing chamber(s)412 and other components of semiconductor processing system 410, thefluid supply system 420, the power supply 430, and the acoustic sensor310, in accordance with some embodiments. The controller system 600receives input signals from the processing chamber(s) 412 and othercomponents of semiconductor processing system 410, the fluid supplysystem 420, the power supply 430, and the acoustic sensor 310, inaccordance with some embodiments.

The controller system 600 includes a processor 602, an input/output(I/O) device 604, a memory 606, and a network interface 608 eachcommunicatively coupled via a bus 610 or other interconnectioncommunication mechanism.

The processor 602 is arranged to execute and/or interpret one or moreset of instructions 612 stored in the memory 606. In some embodiments,the processor 602 is a central processing unit (CPU), a multi-processor,a distributed processing system, an application specific integratedcircuit (ASIC), and/or a suitable processing unit.

The I/O interface 604 is coupled to external circuitry. In someembodiments, the I/O interface 604 includes a keyboard, keypad, mouse,trackball, trackpad, and/or cursor direction keys for communicatinginformation and commands to the processor 602.

The memory 606 (also referred to as a computer-readable medium) includesa random access memory or other dynamic storage device, communicativelycoupled to the bus 610 for storing data and/or instructions forexecution by the processor 602. In some embodiments, the memory 606 isused for storing temporary variables or other intermediate informationduring execution of instructions to be executed by the processor 602. Insome embodiments, the memory 606 also includes a read-only memory orother static storage device coupled to the bus 610 for storing staticinformation and instructions for the processor 602. In some embodiments,the memory 606 is an electronic, magnetic, optical, electromagnetic,infrared, and/or a semiconductor system (or apparatus or device). Forexample, the memory 606 includes a semiconductor or solid-state memory,a magnetic tape, a removable computer diskette, a random access memory(RAM), a read-only memory (ROM), a rigid magnetic disk, and/or anoptical disk. In some embodiments using optical disks, the memory 606includes a compact disk-read only memory (CD-ROM), a compactdisk-read/write (CD-R/W), and/or a digital video disc (DVD).

The memory 606 is encoded with, i.e., storing, the computer programcode, i.e., a set of executable instructions 612, for controlling one ormore components of the semiconductor processing system 410, the fluidsupply system 420, the power supply 430, and the acoustic sensor 310 andcausing the controller system 600 to perform the method 500. In someembodiments, the memory 606 also stores information needed forperforming the method 500 as well as information generated duringperforming the method 500.

The network interface 608 includes a mechanism for connecting to anetwork 609, to which one or more other computer systems are connected.In some embodiments, the network interface 608 includes a wired and/orwireless connection mechanism. The network interface 608 includeswireless network interfaces such as BLUETOOTH, WIFI, WIMAX, GPRS, orWCDMA; or wired network interface such as ETHERNET, USB, or IEEE-1394.In some embodiments, the controller system 600 is coupled with one ormore components of the semiconductor processing system 410, the fluidsupply system 420, the power supply 430, and the acoustic sensor 310 viathe network interface 608. In some embodiments, the controller system600 is directly coupled with one or more components of the semiconductorprocessing system 410, the fluid supply system 420, the power supply430, and the acoustic sensor 310, e.g., with the components coupled tothe bus 610 instead of via the network interface 608.

One aspect of this description relates to a buffer for holding a pipeadapted to transport a fluid. The buffer includes a base, a plurality offingers extending outwardly from a first side of the base. A firstfinger of the plurality of fingers and a second finger of the pluralityof fingers define a cavity for receiving the pipe. The buffer furtherincludes at least one roller on a second side of the based opposite thefirst side. In some embodiments, the first finger has a length less thana length of the second finger. In some embodiments, the second fingerincludes a ridge protruding toward the first finger. The ridge definesan open end of the cavity with the first finger. In some embodiments,the first finger extends outwardly from a first end of the base, and thesecond finger extends outwardly from a central portion of the base. Insome embodiments, a third finger of the plurality of fingers extendsoutwardly from a second end of the base opposite the first end. Thesecond finger is between the first finger and the third finger. In someembodiments, the second finger and the third finger have a same length.In some embodiments, the second finger and the third finger havedifferent lengths. In some embodiments, the second finger and the thirdfinger define another cavity for receiving an electrical cable, theanother cavity having a dimension less than a dimension of the cavity.In some embodiments, the at least one roller is a universal rollerconfigured to move the buffer in any direction. In some embodiments, theat least one roller comprises a rounded bottom. In some embodiments, thebuffer includes a material having a coefficient of friction less than0.1. In some embodiments, the buffer includes polytetrafluoroethylene(PTFE), perfluoroalkoxy (PFA), fluorinated poly ethylene propylene(FPEP), polyvinylidene fluoride (PVDF), polysulfone, or polyether etherketone (PEEK).

Another aspect of this description relates to an arrangement in asemiconductor fabrication facility. The arrangement includes asemiconductor processing system comprising a processing chamber, a fluidsupply system comprising a pipe connected to the processing chamber andconfigured to transport a fluid, a power supply comprising an electricalcable connected to processing chamber, and a buffer placed on a supportplate and adapted to elevate the pipe and the electrical cable from thesupport plate. The buffer includes a base, a plurality of fingers on afirst side of the base, and a roller on a second side of the basedopposite the first side and contacting the support plate. The pluralityof fingers includes a first finger extending outwardly from a first endof the base, a second finger extending outwardly from a central portionof the base, and a third finger extending outwardly from a second end ofthe base opposite the first end. The first finger and the second fingerdefine a first cavity for receiving the pipe, and the second finger andthe third finger define a second cavity for receiving the electricalcable. The arrangement further includes an acoustic sensor adapted todetect acoustic waves generated by the roller. In some embodiments, thesecond finger includes a ridge protruding toward the first finger. Theridge defines an open end of the cavity with the first finger. In someembodiments, the support plate includes a metal, a wood, or a plywood.In some embodiments, the buffer includes a material having a coefficientof friction lower that a coefficient of friction of the support plate.In some embodiments, the acoustic sensor is an ultrasonic sensor. Insome embodiments, the arrangement further includes a sensor control unitadapted to analyze changes in frequencies of the acoustic waves.

Still another aspect of this description relates to a method ofmonitoring wear of a buffer. The method includes holding a pipe fortransporting a fluid and an electrical cable using a buffer placed on asupport plate. The buffer includes a base, a plurality of fingers on afirst side of the base, and a roller on a second side of the basedopposite the first side and contacting the support plate. The pluralityof fingers includes a first finger extending outwardly from a first endof the base, a second finger extending outwardly from a central portionof the base, and a third finger extending outwardly from a second end ofthe base opposite the first end. The first finger and the second fingerdefine a first cavity for receiving the pipe, and the second finger andthe third finger defines a second cavity for receiving the electricalcable. The method further includes detecting acoustic waves generated bythe roller on the support plate. The method further includes analyzingchanges in frequencies of the acoustic waves to determine an extent ofthe wear of the roller over time. The method further includes triggeringan alert when an increase in the frequencies of the acoustic wavesexceeds a pre-determined threshold value. In some embodiments, themethod further includes replacing the buffer after the alert istriggered.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1. A buffer for holding a pipe adapted to transport a fluid, comprising:a base; a plurality of fingers extending outwardly from a first side ofthe base, wherein a first finger of the plurality of fingers and asecond finger of the plurality of fingers define a cavity for receivingthe pipe; and at least one roller on a second side of the base oppositethe first side.
 2. The buffer of claim 1, wherein the first finger has alength less than a length of the second finger.
 3. The buffer of claim1, wherein the second finger comprises a ridge protruding toward thefirst finger, wherein the ridge defines an open end of the cavity withthe first finger.
 4. The buffer of claim 1, wherein the first fingerextends outwardly from a first end of the base, and the second fingerextends outwardly from a central portion of the base.
 5. The buffer ofclaim 4, wherein a third finger of plurality of fingers extendsoutwardly from a second end of the base opposite the first end, whereinthe second finger is between the first finger and the third finger. 6.The buffer of claim 5, wherein the second finger and the third fingerhave a same length.
 7. The buffer of claim 5, wherein the second fingerand the third finger have different lengths.
 8. The buffer of claim 5,wherein the second finger and the third finger define another cavity forreceiving an electrical cable, the another cavity having a dimensionless than a dimension of the cavity.
 9. The buffer of claim 1, whereinthe at least one roller is a universal roller configured to move thebuffer in any direction.
 10. The buffer of claim 1, wherein the at leastone roller comprises a rounded bottom.
 11. The buffer of claim 1,wherein the buffer comprises a material having a coefficient of frictionless than 0.1.
 12. The buffer of claim 1, wherein the buffer comprisespolytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), fluorinated polyethylene propylene (FPEP), polyvinylidene fluoride (PVDF), polysulfone,or polyether ether ketone (PEEK).
 13. An arrangement in a semiconductorfabrication facility, comprising: a semiconductor processing systemcomprising a processing chamber; a fluid supply system comprising a pipeconnected to the processing chamber and configured to transport a fluid;a power supply comprising an electrical cable connected to processingchamber; a buffer placed on a support plate and adapted to elevate thepipe and the electrical cable from the support plate, the buffercomprising: a base, a plurality of fingers on a first side of the base,wherein the plurality of fingers comprises a first finger extendingoutwardly from a first end of the base, a second finger extendingoutwardly from a central portion of the base, and a third fingerextending outwardly from a second end of the base opposite the firstend, wherein the first finger and the second finger define a firstcavity for receiving the pipe, and the second finger and the thirdfinger define a second cavity for receiving the electrical cable, and aroller on a second side of the base opposite the first side andcontacting the support plate; and an acoustic sensor adapted to detectacoustic waves generated by the roller.
 14. The arrangement of claim 13,wherein the second finger comprises a ridge protruding towards the firstfinger, wherein the ridge defines an open end of the first cavity withthe first finger.
 15. The arrangement of claim 13, wherein the supportplate comprises a metal, a wood, or a plywood.
 16. The arrangement ofclaim 13, the buffer comprises a material having a coefficient offriction lower that a coefficient of friction of the support plate. 17.The arrangement of claim 13, wherein the acoustic sensor is anultrasonic sensor.
 18. The arrangement of claim 13, further comprising asensor control unit adapted to analyze changes in frequencies of theacoustic waves.
 19. A method of monitoring wear of a buffer, comprising:providing a buffer to hold a pipe for transporting a fluid and anelectrical cable, the buffer separating the pipe and the electricalcable from a support plate and comprising: a base; a plurality offingers on a first side of the base, wherein the plurality of fingerscomprises a first finger extending outwardly from a first end of thebase, a second finger extending outwardly from a central portion of thebase, and a third finger extending outwardly from a second end of thebase opposite the first end, wherein the first finger and the secondfinger define a first cavity for receiving the pipe, and the secondfinger and the third finger defines a second cavity for receiving theelectrical cable; and a roller on a second side of the base opposite thefirst side and contacting the support plate; detecting acoustic wavesgenerated by the roller on the support plate; analyzing changes infrequencies of the acoustic waves to determine an extent of the wear ofthe roller over time; and triggering an alert when an increase in thefrequencies of the acoustic waves exceeds a pre-determined thresholdvalue.
 20. The method of claim 19, further comprising replacing thebuffer after the alert is triggered.